ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,994, issued on June 23.
"Method for manufacturing semiconductor device" was invented by Shogo Sobue (Tokyo), Saeko Ogawa (Tokyo), Daisuke Ikeda (Tokyo) and Keisuke Okawara (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device including forming a temporary fixing laminated body including a carrier, and a sealing structure body provided on a main surface of the carrier and including a plurality of semiconductor chips and a sealing portion sealing the plurality of semiconductor chips, and removing the carrier from the temporary fixing laminated body. The semiconductor chip includes a chip main body incl...