US Patent Issued on June 16 for "Electronic package and method for forming the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,097, issued on June 16.

"Electronic package and method for forming the same" was invented by HyoDong Ryu (Incheon, South Korea), SeungHyun Lee (Incheon, South Korea), WonSang Rhee (Incheon, South Korea), HunTaek Lee (Gyeonggi-do, South Korea) and KyoungHee Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electronic component, comprising: a substrate; a first set of conductive pads on the substrate and at which a set of terminals of a first electronic component are to be mounted, respectively; and solder paste formed on each of the first set of conductive pads, wherein the solder paste exposes a portion of a surf...