US Patent Issued on July 28 for "Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods" (Idaho Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,802, issued on July 28.

"Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods" was invented by Chan Yoo (Boise, Idaho) and Todd O. Bolken (Eagle, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the encapsulant separates the spacer material from an active surface of a semiconductor device and at least one interconnect projecting away from the active surface. The method further includes molding the encapsu...