ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,139, issued on July 21.
"Method for manufacturing a printed circuit board with an embedded shield" was invented by Kuo-Hao Pao (Hsinchu City, Taiwan) and Yu-Cheng Lin (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "This invention introduces an advanced method for manufacturing printed circuit boards (PCBs) featuring an embedded shield, enhancing the integrity and functionality of electronic devices. The process involves forming trenches on the PCB, filling them with solder paste, and seamlessly integrating a shield with a frame through a meticulous soldering procedure. This refined technique offers superior reliability and paves...