US Patent Issued on Jan. 27 for "Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,751, issued on Jan. 27.

"Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing" was invented by Yasuyuki Oyama (Tokyo), Emi Miyazawa (Tokyo), Yuta Akasu (Tokyo) and Ryoji Furutani (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device, the method including irradiating a laminated body for temporary fixing with light and thereby separating the semiconductor member from a resin layer for temporary fixing. The laminated body for temporary fixing is formed by a method including: laminating a film material for temp...