US Patent Issued on Jan. 20 for "Fan-out packaging device using bridge and method of manufacturing fan-out packaging device using bridge" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,792, issued on Jan. 20.

"Fan-out packaging device using bridge and method of manufacturing fan-out packaging device using bridge" was invented by Byung Joon Han (Seoul, South Korea) and Byung Hoon Ahn (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a fan-out packaging device and a method of manufacturing the fan-out packaging device, and more particularly a fan-out packaging device using a bridge, the fan-out packaging device including a bridge formed at one side of a fan-out package having two or more dies integrated therein, at least one trace formed at the bridge, and a connection terminal formed at an end of ...