US Patent Issued on Feb. 3 for "Method for creating interconnections between a substrate and electronic components" (New Jersey Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,270, issued on Feb. 3.

"Method for creating interconnections between a substrate and electronic components" was invented by Andrew Stemmermann (Long Branch, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens."

The patent was filed on Feb. ...