US Patent Issued on Feb. 3 for "Adhesive tape platform with form factor for improved sensing and external sensor probe" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,668, issued on Feb. 3.

"Adhesive tape platform with form factor for improved sensing and external sensor probe" was invented by Hendrik J Volkerink (Palo ALto, Calif.), Ajay Khoche (West San Jose, Calif.) and Saurabh Sanghai (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wireless sensor device includes a flexible substrate, a cover layer on the flexible substrate, a device layer between the flexible substrate and the cover layer, and a printed circuit board connecting components of the device layer including an electrostatic discharge protected port for connecting an external sensor probe to the wireless sensor device. The device...