US Patent Issued on Feb. 24 for "Method for making semiconductor device with double side molding" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,087, issued on Feb. 24.

"Method for making semiconductor device with double side molding" was invented by KyoWang Koo (Incheon, South Korea), SeoJun Bae (Gyeonggi-do, South Korea) and JungSub Lee (Chungcheongnam-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a top surface and a bottom surface; a top electronic component mounted on the top surface of the substrate; at least one conductive pillar formed on the bottom surface of the substrate; and a protection layer attached on the bottom surface of the subst...