US Patent Issued on Feb. 24 for "Method for forming a partial shielding for an electronic assembly" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,060, issued on Feb. 24.

"Method for forming a partial shielding for an electronic assembly" was invented by EunByeol Lee (Incheon, South Korea), DooSoub Shin (Incheon, South Korea), YeJin Park (Incheon, South Korea) and HyukCheon Kwon (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for forming a partial shielding for an electronic assembly, comprising: providing an electronic assembly mounted on a mother board, wherein the electronic assembly comprises a substrate, and at least one electronic component and a conductive pattern mounted on a top surface of the substrate; disposing a mask onto the substrate...