ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,714, issued on Feb. 17.
"Method for making electronic package" was invented by SeungHyun Lee (Incheon, South Korea), KyoungHee Park (Seoul, South Korea), HunTaek Lee (Gyeonggi-do, South Korea), KyungHwan Kim (Seoul, South Korea) and WonSang Rhee (Incheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making an electronic package is provided. The method includes providing a substrate strip comprising substrate assemblies, each substrate assembly comprises a first substrate and a second substrate connected to the first substrate via a flexible link, the first substrate comprises a first mounting surface, the second substrate ...