ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,668, issued on Feb. 17.
"Airflow orifice adjusting device of package thermal-shrinking oven" was invented by Tzu-Chin Hung (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An airflow orifice adjusting device of a package thermal-shrinking oven includes at least one airflow orifice board mounted to an inside surface of a hot airflow box of the package thermal-shrinking oven and formed with series of airflow orifices, at least one track board mounted to an outside of the hot airflow box and formed with a plurality of track holes, a plurality of adjusting levers, and a plurality of airflow-blocking adjusting plates mounted to the airflow ...