ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,981, issued on Dec. 23.
"Plasma-enhanced chemical vapor deposition for structurally-complex substrates" was invented by Austin Lo (Traverse City, Mich.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes a first outer surface, a second outer surface opposite the first outer surface, and a region having a volume extending from the first outer surface to the second outer surface. At least a portion of the volume of this region defines a cavity of an interstitial site where the interstitial site is defined by a wall having a surface and the surface includes a plasma-formed deposition layer."
The patent was filed on June 26, 2023, under...