US Patent Issued on Dec. 2 for "Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,371, issued on Dec. 2.

"Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension" was invented by Steve Hsu (Chongqing, China) and Hans Park (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, a cavity delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure, and a component embedded in the cavity and arranged on t...