US Patent Issued on Aug. 4 for "Sealing gasket for semiconductor production apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. D1,139,860, issued on Aug. 4.

"Sealing gasket for semiconductor production apparatus" was invented by Satoshi Toudou (Amagasaki, Japan).

The patent was filed on April 22, 2024, under Application No. D/524,805.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1139860&OS=D1139860&RS=D1139860

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