US Patent Issued on Aug. 4 for "Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,369, issued on Aug. 4.

"Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method" was invented by Shogo Sobue (Tokyo), Shinji Irizawa (Tokyo), Mika Tanaka (Tokyo) and Saeko Ogawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing an electronic device includes a first step of pasting a support to an organic substrate having a thickness of 1000 micro metre or less, with a temporary fixing material interposed therebetween, to obtain a laminated body; a second step of heating the temporary fixing material of the laminated body; a third step of mounting a sem...