US Patent Issued on Aug. 4 for "Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,047, issued on Aug. 4.

"Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device" was invented by Shogo Sobue (Tokyo), Yuki Nakamura (Tokyo), Saeko Ogawa (Tokyo), Daisuke Ikeda (Tokyo) and Keisuke Okawara (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a semiconductor device, including forming a temporary fixing laminated body including a carrier, and a sealing structure body provided on a main surface of the carrier, and removing the carrier from the temporary fixing laminated body. The temporary fix...