US Patent Issued on Aug. 18 for "Apparatus and method for selectively forming a shielding layer on a semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,931, issued on Aug. 18.

"Apparatus and method for selectively forming a shielding layer on a semiconductor package" was invented by GunHyuck Lee (Incheon, South Korea) and Yujeong Jang (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for selectively forming a shielding layer on a semiconductor package is provided. The apparatus includes: a tray including a plurality of package seats, the tray defines, for each of the plurality of package seats, one or more sets of guide holes outside the package seat; deposition masks, each of the deposition masks includes: a set of pins releasably inserted within one set of the one ...