INTERNATIONAL PATENT: ZTE CORPORATION, 中兴通讯股份有限公司 FILES APPLICATION FOR "CHIP INTERCONNECTION PROCESSING METHOD AND CHIP"

GENEVA, Jan. 4 -- ZTE CORPORATION (ZTE Plaza, Keji Road South, Hi-Tech Industrial Park, Nanshan DistrictShenzhen, Guangdong 518057), 中兴通讯股份有限公司 (中国广东省深圳市南山区高新技术产业园科技南路中兴通讯大厦) filed a patent application (PCT/CN2025/099664) for "CHIP INTERCONNECTION PROCESSING METHOD, AND CHIP" on Jun 06, 2025. With publication no. WO/2026/001638, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Paten...