INTERNATIONAL PATENT: ZING SEMICONDUCTOR CORPORATION, 上海新昇半导体科技有限公司 FILES APPLICATION FOR "STANDARD SHEET AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MATERIAL DEFECT CORRECTION METHOD AND MEASUREMENT DEVICE CORRECTION METHOD"

Posted On: 2026-03-16

GENEVA, March 16 -- ZING SEMICONDUCTOR CORPORATION (No. 1000, Yunshui Rd., Lin-gang Special Area Of China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201306), 上海新昇半导体科技有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区临港新片区云水路1000号) filed a patent application (PCT/CN2025/089459) for "STANDARD SHEET AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MATERIAL DEFECT CORRECTION METHOD, AND MEASUREMENT DEVICE CORRECTION METHOD" on Apr 17, 2025. With pu...

Click here to read full article from source

To read the full article or to get the complete feed from this publication, please Contact Us.

Exclusive

Category

Source

Publication

Location

INTERNATIONAL PATENT: ZING SEMICONDUCTOR CORPORATION, 上海新昇半导体科技有限公司 FILES APPLICATION FOR "STANDARD SHEET AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MATERIAL DEFECT CORRECTION METHOD AND MEASUREMENT DEVICE CORRECTION METHOD"