INTERNATIONAL PATENT: ZING SEMICONDUCTOR CORPORATION, 上海新昇半导体科技有限公司, ZING JK SEMICONDUCTOR CORPORATION, 上海新昇晶科半导体科技有限公司 FILES APPLICATION FOR "GRINDING CARRIER ASSEMBLY, GRINDING APPARATUS AND GRINDING METHOD"

Posted On: 2026-03-08

GENEVA, March 8 -- ZING SEMICONDUCTOR CORPORATION (No. 1000, Yunshui Rd., Lin-gang Special Area Of China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201306), 上海新昇半导体科技有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区临港新片区云水路1000号), ZING JK SEMICONDUCTOR CORPORATION (No. 1000, Yunshui Rd., Lin-gang Special Area Of China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201306), 上海新昇晶科半ë...

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INTERNATIONAL PATENT: ZING SEMICONDUCTOR CORPORATION, 上海新昇半导体科技有限公司, ZING JK SEMICONDUCTOR CORPORATION, 上海新昇晶科半导体科技有限公司 FILES APPLICATION FOR "GRINDING CARRIER ASSEMBLY, GRINDING APPARATUS AND GRINDING METHOD"