INTERNATIONAL PATENT: YAZAKI CORPORATION, 矢崎総業株式会社 FILES APPLICATION FOR "BUNDLE EXTRACTION DEVICE AND BUNDLE EXTRACTION METHOD"

GENEVA, Jan. 5 -- YAZAKI CORPORATION (8-15, Konan 1-Chome, Minato-ku, Tokyo1080075), 矢崎総業株式会社 (東京都港区港南一丁目８番１５号) filed a patent application (PCT/JP2025/019056) for "BUNDLE EXTRACTION DEVICE AND BUNDLE EXTRACTION METHOD" on May 27, 2025. With publication no. WO/2026/004451, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSUKIJI Nobuto (c/o Yazaki Parts Co., Ltd., 2...