GENEVA, May 11 -- YAMAHA ROBOTICS CO., LTD. (51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo2088585), ヤマハロボティクス株式会社 (東京都武蔵村山市伊奈平二丁目５１番地の１) filed a patent application (PCT/JP2025/034782) for "BONDING DEVICE, BONDING METHOD, AND WIRE CUTTER" on Sep 30, 2025. With publication no. WO/2026/094523, the details related to the patent application was published on May 07, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellec...