GENEVA, July 7 -- XI'AN YEP TELECOM TECHNOLOGY CO., LTD. (Building A, 1rd Floor, Huaqin Technology Xi'an R & D Center, No. 2088 Yunshui 6th Road, High Tech ZoneXi'an, Shaanxi 710076), 西安易朴通讯技术有限公司 (中国陕西省西安市高新区云水六路2088号华勤技术西安研发中心A栋1层整层) filed a patent application (PCT/CN2024/101170) for "HEAT DISSIPATION ASSEMBLY AND CIRCUIT BOARD ASSEMBLY" on Jun 25, 2024. With publication no. WO/2025/138656, the details related to the patent application was published ...