INTERNATIONAL PATENT: XI'AN JIAOTONG UNIVERSITY, 西安交通大学 FILES APPLICATION FOR "INTERFACE THERMAL CONDUCTIVITY COEFFICIENT DISTRIBUTION OPTIMIZATION DESIGN METHOD AND SYSTEM FOR IMPROVING THERMAL CONTACT PERFORMANCE OF ASSEMBLY INTERFACE"

GENEVA, May 17 -- XI'AN JIAOTONG UNIVERSITY (No.28, Xianning West Road, Beilin DistrictXi'an, Shaanxi 710049), 西安交通大学 (中国陕西省西安市碑林区咸宁西路28号) filed a patent application (PCT/CN2025/087133) for "INTERFACE THERMAL CONDUCTIVITY COEFFICIENT DISTRIBUTION OPTIMIZATION DESIGN METHOD AND SYSTEM FOR IMPROVING THERMAL CONTACT PERFORMANCE OF ASSEMBLY INTERFACE" on Apr 03, 2025. With publication no. WO/2026/097776, the details related to the patent application was published on May 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is...