INTERNATIONAL PATENT: XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD., 西安奕斯伟材料科技股份有限公司 FILES APPLICATION FOR "WAFER AND ROUGHNESS MEASUREMENT METHOD AND APPARATUS THEREFOR AND DEVICE AND MEDIUM"

GENEVA, Feb. 22 -- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. (Room 1-3-029, No.1888 South Xifeng Rd., Hi-tech ZoneXi'an, Shaanxi 710100), 西安奕斯伟材料科技股份有限公司 (中国陕西省西安市高新区西沣南路1888号1-3-029室) filed a patent application (PCT/CN2024/139539) for "WAFER AND ROUGHNESS MEASUREMENT METHOD AND APPARATUS THEREFOR, AND DEVICE AND MEDIUM" on Dec 16, 2024. With publication no. WO/2026/036602, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International P...