INTERNATIONAL PATENT: WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD., 无锡华润华晶微电子有限公司 FILES APPLICATION FOR "POWER MODULE PACKAGING STRUCTURE"

GENEVA, April 5 -- WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. (No. 180-6, Linghu Road, Wuxi Taihu International Science And Technology ParkWuxi, Jiangsu 214111), 无锡华润华晶微电子有限公司 (中国江苏省无锡市太湖国际科技园菱湖大道180号-6) filed a patent application (PCT/CN2025/123076) for "POWER MODULE PACKAGING STRUCTURE" on Sep 22, 2025. With publication no. WO/2026/067339, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classif...