GENEVA, June 24 -- AMADA CO.,LTD. filed a patent application (JP2025/040836) for “WORKPIECE HOLDING DIE FOR PANEL BENDER”. With publication no. WO/2026/116268, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B21D 5/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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