INTERNATIONAL PATENT: WOLFSPEED, INC. FILES APPLICATION FOR "POWER SEMICONDUCTOR PACKAGE"

GENEVA, June 12 -- WOLFSPEED, INC. (4600 Silicon Dr.Durham, North Carolina 27703) filed a patent application (PCT/US2024/056789) for "POWER SEMICONDUCTOR PACKAGE" on Nov 21, 2024. With publication no. WO/2025/117307, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DEZSI, Geza (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703), LIN, Yusheng (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703)

Abstract: Power semiconductor packages are provided. In one example, the power semiconductor pack...