INTERNATIONAL PATENT: WOLFSPEED, INC. FILES APPLICATION FOR "POWER SEMICONDUCTOR DEVICES WITH BOND PADS HAVING STRUCTURAL SUPPORT LAYERS"

GENEVA, March 31 -- WOLFSPEED, INC. (4600 Silicon DriveDurham, NC 27703) filed a patent application (PCT/US2025/046551) for "POWER SEMICONDUCTOR DEVICES WITH BOND PADS HAVING STRUCTURAL SUPPORT LAYERS" on Sep 16, 2025. With publication no. WO/2026/064298, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PANDYA, Sneha (4813 Sunset FairwaysApex, NC 27539), HARRINGTON, Thomas (1009 Tadpole Ct.Durham, NC 27703), RICHTER, Daniel (4104 Earl Grey Ct.Raleigh, NC 27612)

Abstract: A semiconductor device includes a semiconductor die...