GENEVA, Sept. 7 -- LG ELECTRONICS INC. filed a patent application (KR2026/001857) for “WIRE BENDING SYSTEM AND WIRE BENDING METHOD”. With publication no. WO/2026/182417, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B21F 1/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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