International Patent: WAFER POLISHING ENDPOINT DETECTION METHOD AND SYSTEM

GENEVA, Sept. 18 -- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC. filed a patent application (CN2025/140673) for “WAFER POLISHING ENDPOINT DETECTION METHOD AND SYSTEM”. With publication no. WO/2026/184165, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B24B 49/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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