International Patent: WAFER COOLING MODULE AND METHOD OF COOLING SYSTEM ON WAFER USING WAFER COOLING MODULE

GENEVA, Aug. 31 -- AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH filed a patent application (SG2026/050061) for “WAFER COOLING MODULE AND METHOD OF COOLING SYSTEM ON WAFER USING WAFER COOLING MODULE”. With publication no. WO/2026/177662, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 40/47

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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