International Patent: VERTICALLY PERFORATED CLAY BRICKS WITH ENHANCED STRUCTURAL PERFORMANCE THROUGH VOID GEOMETRY OPTIMIZATION

GENEVA, July 9 -- T.C. ANKARA UNIVERSITESI REKTORLUGU filed a patent application (TR2025/052012) for “VERTICALLY PERFORATED CLAY BRICKS WITH ENHANCED STRUCTURAL PERFORMANCE THROUGH VOID GEOMETRY OPTIMIZATION”. With publication no. WO/2026/147473, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: E04C 1/39

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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