INTERNATIONAL PATENT: VERSUM MATERIALS US, LLC FILES APPLICATION FOR "CHEMICAL MECHANICAL PLANARIZATION FOR ADVANCED NODE HIGH BANDWIDTH MEMORY DEVICE"

GENEVA, April 14 -- VERSUM MATERIALS US, LLC (Versum Materials US LLC8555 South River ParkwayTEMPE, Arizona 85284) filed a patent application (PCT/US2025/043571) for "CHEMICAL MECHANICAL PLANARIZATION FOR ADVANCED NODE HIGH BANDWIDTH MEMORY DEVICE" on Aug 26, 2025. With publication no. WO/2026/075745, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MURELLA, Krishna P. (c/o VERSUM MATERIALS US, LLC8555 South River ParkwayTempe, Arizona 85284), ROSE, Joseph D. (c/o VERSUM MATERIALS US, LLC8555 South River ParkwayTempe, Ariz...