GENEVA, May 12 -- VALEO VISION (34 rue Saint Andre93012 Bobigny), MASSEY, Andrew (1231 A Avenue NorthSeymour, Michigan 47274) filed a patent application (PCT/US2025/053322) for "OVERMOLDED INTERCONNECT DEVICE" on Oct 30, 2025. With publication no. WO/2026/096756, the details related to the patent application was published on May 07, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VALEO VISION (34 rue Saint Andre93012 Bobigny), MASSEY, Andrew (1231 A Avenue NorthSeymour, Michigan 47274)
Abstract: A method for forming an overmolded interconnect device includes molding a first layer of an auto...