GENEVA, March 2 -- VALEO SYSTEMES THERMIQUES (8 rue Louis Lormand La Verriere78320 Le Mesnil-Saint-Denis) filed a patent application (PCT/EP2025/072468) for "COOLING DEVICE AND MODULE FOR ELECTRONIC COMPONENTS" on Aug 05, 2025. With publication no. WO/2026/041406, the details related to the patent application was published on Feb 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MULLER, Jean-Damien (C/o Valeo Systemes ThermiquesLieu Dit Le Pre Sec72210 La Suze Sur Sarthe)
Abstract: The invention relates to a cooling device (1) for electronic components (6), the device comprising a cooling...