International Patent: USE OF COMPOUND, MICROARRAY CHIP SUBSTRATE, AND MICROARRAY CHIP AND USE THEREOF AND METHOD THEREFOR

GENEVA, June 24 -- BOE TECHNOLOGY GROUP CO., LTD. filed a patent application (CN2025/130680) for “USE OF COMPOUND, MICROARRAY CHIP SUBSTRATE, AND MICROARRAY CHIP AND USE THEREOF AND METHOD THEREFOR”. With publication no. WO/2026/113788, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08F 20/18

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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