International Patent: USE OF A FLAME-RETARDANT MULTILAYER STRUCTURE FOR COOLING ELECTRONIC INFRASTRUCTURE, AND COOLING CIRCUIT

GENEVA, Oct. 15 -- ARKEMA FRANCE filed a patent application (EP2026/060347) for “USE OF A FLAME-RETARDANT MULTILAYER STRUCTURE FOR COOLING ELECTRONIC INFRASTRUCTURE, AND COOLING CIRCUIT”. With publication no. WO/2026/215425, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B32B 1/08

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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