International Patent: UPPER ASSEMBLY, SUBSTRATE PROCESSING DEVICE, AND TOP PLATE ASSEMBLY

GENEVA, July 27 -- TOKYO ELECTRON LIMITED filed a patent application (JP2026/000156) for “UPPER ASSEMBLY, SUBSTRATE PROCESSING DEVICE, AND TOP PLATE ASSEMBLY”. With publication no. WO/2026/155027, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 50/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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