GENEVA, Aug. 7 -- JSR CORPORATION filed a patent application (JP2026/000859) for “UNDERLAYER FILM-FORMING COMPOSITION FOR METAL-CONTAINING RESIST FILM AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE”. With publication no. WO/2026/163813, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/11
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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