International Patent: ULTRASONIC SENSOR, ULTRASONIC FINGERPRINT RECOGNITION MODULE, AND ELECTRONIC DEVICE

GENEVA, July 31 -- CHIPSEMI SEMICONDUCTOR (NINGBO) CO., LTD. filed a patent application (CN2026/074717) for “ULTRASONIC SENSOR, ULTRASONIC FINGERPRINT RECOGNITION MODULE, AND ELECTRONIC DEVICE”. With publication no. WO/2026/158614, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06V 40/13

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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