GENEVA, Sept. 21 -- TOWA CORPORATION (5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto6018105), ＴＯＷＡ株式会社 (京都府京都市南区上鳥羽上調子町５番地) filed a patent application (PCT/JP2024/035381) for "RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE" on Oct 03, 2024. With publication no. WO/2025/191894, the details related to the patent application was published on Sep 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....