INTERNATIONAL PATENT: TOPPAN HOLDINGS INC., ＴＯＰＰＡＮホールディングス株式会社 FILES APPLICATION FOR "PACKAGE STRUCTURE, ELECTRONIC DEVICE SYSTEM AND PHOTOELECTRIC FUSION DEVICE"

GENEVA, March 17 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東一丁目５番１号) filed a patent application (PCT/JP2025/019074) for "PACKAGE STRUCTURE, ELECTRONIC DEVICE SYSTEM, AND PHOTOELECTRIC FUSION DEVICE" on May 27, 2025. With publication no. WO/2026/053509, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Wor...