GENEVA, Jan. 17 -- TONGXIN MICROELECTRONICS CO., LTD. (106A F/1, Building B-1, Zhongguancun DongshengTechnology Park Northern TerritoryNo. 66 Xixiaokou Road, Haidian District, BeijingHaidian District, Beijing 100000), 紫光同芯微电子有限公司 (中国北京市海淀区西小口路66号中关村东升科技园*北领地B-1楼一层106A) filed a patent application (PCT/CN2025/076740) for "DUAL-INTERFACE SMART CARD SUBSTRATE LAYER, AND DUAL-INTERFACE SMART CARD" on Feb 10, 2025. With publication no. WO/2026/011762, the details related to the patent ...