INTERNATIONAL PATENT: TONGXIN MICROELECTRONICS CO., LTD., 紫光同芯微电子有限公司 FILES APPLICATION FOR "DUAL-INTERFACE SMART CARD SUBSTRATE LAYER AND DUAL-INTERFACE SMART CARD"

Posted On: 2026-01-17

GENEVA, Jan. 17 -- TONGXIN MICROELECTRONICS CO., LTD. (106A F/1, Building B-1, Zhongguancun Dongsheng Technology Park Northern Territory, No.66 Xixiaokou Road, Haidian District, BeijingHaidian District, Beijing 100000), 紫光同芯微电子有限公司 (中国北京市海淀区西小口路66号中关村东升科技园*北领地B-1楼一层106A) filed a patent application (PCT/CN2025/076738) for "DUAL-INTERFACE SMART CARD SUBSTRATE LAYER AND DUAL-INTERFACE SMART CARD" on Feb 10, 2025. With publication no. WO/2026/011760, the details related to the patent...

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INTERNATIONAL PATENT: TONGXIN MICROELECTRONICS CO., LTD., 紫光同芯微电子有限公司 FILES APPLICATION FOR "DUAL-INTERFACE SMART CARD SUBSTRATE LAYER AND DUAL-INTERFACE SMART CARD"