INTERNATIONAL PATENT: TOMOEGAWA CORPORATION, 株式会社巴川コーポレーション FILES APPLICATION FOR "ADHESIVE SHEET, PRECURSOR OF SEMICONDUCTOR DEVICE INCLUDING ADHESIVE SHEET, SEMICONDUCTOR DEVICE PRODUCED USING ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING ADHESIVE SHEET"

GENEVA, Jan. 13 -- TOMOEGAWA CORPORATION (2-1-3 Kyobashi, Chuo-ku, Tokyo1048335), 株式会社巴川コーポレーション (東京都中央区京橋二丁目１番３号) filed a patent application (PCT/JP2025/016206) for "ADHESIVE SHEET, PRECURSOR OF SEMICONDUCTOR DEVICE INCLUDING ADHESIVE SHEET, SEMICONDUCTOR DEVICE PRODUCED USING ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING ADHESIVE SHEET" on Apr 28, 2025. With publication no. WO/2026/009550, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under ...