GENEVA, March 10 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2025/026690) for "METHOD FOR MANUFACTURING SUBSTRATE, AND GRINDING DEVICE" on Jul 28, 2025. With publication no. WO/2026/048371, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MASE, Fumio (c/o TOKY...