INTERNATIONAL PATENT: TOKYO OHKA KOGYO CO., LTD., 東京応化工業株式会社 FILES APPLICATION FOR "RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, ACID GENERATION AGENT, ACID DIFFUSION CONTROL AGENT AND HIGH MOLECULAR WEIGHT COMPOUND"

GENEVA, Dec. 23 -- TOKYO OHKA KOGYO CO., LTD. (150, Nakamaruko, Nakahara-ku, Kawasaki-shi, Kanagawa2110012), 東京応化工業株式会社 (神奈川県川崎市中原区中丸子１５０番地) filed a patent application (PCT/JP2025/020850) for "RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, ACID GENERATION AGENT, ACID DIFFUSION CONTROL AGENT, AND HIGH MOLECULAR WEIGHT COMPOUND" on Jun 09, 2025. With publication no. WO/2025/258562, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Cl...