INTERNATIONAL PATENT: TOKUYAMA CORPORATION, 株式会社トクヤマ FILES APPLICATION FOR "METHOD FOR WELDING SILICON MEMBERS AND WELDED SILICON BODY"

GENEVA, Jan. 5 -- TOKUYAMA CORPORATION (1-1, Mikage-cho, Shunan-shi, Yamaguchi7458648), 株式会社トクヤマ (山口県周南市御影町１番１号) filed a patent application (PCT/JP2025/017586) for "METHOD FOR WELDING SILICON MEMBERS, AND WELDED SILICON BODY" on May 14, 2025. With publication no. WO/2026/004377, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ASANO Tetsurou (c/o Tokuyama Corporation, 1-1, Mikag...